废弃电路板非金属粉末在建材中的应用研究

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3.0 侯斌 2024-11-19 5 4 2.94MB 67 页 15积分

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摘要

废弃电路板非金属粉末的资源化处理是目前急需解决的技术难题。本文考虑

到我国对建材的需求量巨大，因此提出将废弃电路板非金属粉末应用于建筑材料

中，在保障建筑材料应用性能的同时，也实现了废弃电路板非金属粉末的资源化

利用。课题从两个方面考虑资源化利用废弃电路板非金属粉末，一是探究将其作

为水泥基增强材料，另一方面是将其配制为一种装饰砂浆，本文主要开展的研究

工作如下：

（1）对废弃电路板非金属粉末进行了化学元素组成分析并验证了它的无害

性。废弃电路板非金属粉末中主要元素为碳和氧，共占 79%，硅元素含量达

7.56%，钙元素含量为 3.64%，并且硅与钙可促进水泥水化反应，这也是将其作

为水泥基增强材料的理论依据。同时，废弃电路板非金属粉末中重金属含量在安

全范围内，尤其锌、汞、铍等危害较大的重金属含量已低于最小检测值。根据环

保检测分析以及生物毒性测试结果显示，废弃电路板非金属粉末是安全无毒的，

这也是将其用于建材中的前提。

（2）证明了废弃电路板非金属粉末可以作为水泥基增强材料。试验将两种

不同类型的废弃电路板非金属粉末掺入混凝土和砂浆试件中，当细粉末状的废弃

电路板非金属粉末在混凝土试件中掺量为 16.5%时，试件早期强度提高 22%，而

纤维状的废弃电路板非金属粉末在砂浆试件中掺量为 5.5%时，试件早期强度提

高22%。当粉末添加量达 38.5%时，混凝土试件不成型且呈蜂窝状，这是由于废

弃电路板非金属粉末作为骨料填充减少了水泥浆形成的缘故。试验证明了废弃电

路板非金属粉末在一定掺量的限值下可提水泥基材料强度。

（3）研究了以废弃电路板非金属粉末为原料配制一种装饰性砂浆。利用两

种类型的废弃电路板非金属粉末颜色形态各异的特点，配制装饰性砂浆，同时可

以通过添加矿物染料丰富装饰砂浆的颜色。课题使用空气压缩喷射器具将这种装

饰砂浆喷射到清水墙面、石膏雕塑以及混凝土板上，发现其观赏效果好且不易脱

落。同时测试了装饰性砂浆的抗压强度、抗折强度及拉伸粘接强度，研究结果表

明其能满足作为装饰砂浆的基本力学特性要求。试验表明将废弃电路板非金属粉

末作为装饰性砂浆是可行有效的，并且能大量地处置废弃电路板非金属粉末。

（4）从粒径分布的角度分析了废弃电路板非金属粉末对水泥基的增强作用。

通过激光粒度分析仪分析了细粉末状的废弃电路板非金属粉末的粒径分布，分析

结果显示，细粉末状的废弃电路板非金属粉末中 95.6%颗粒粒径小于 132μm，可

起到微集料作用，将其填充于水泥浆体间隙，可增强水泥基体的密实度。而纤维

状的废弃电路板非金属粉末可起到乱向加筋作用，并且其中的硅与钙元素可促进

水泥水化反应向正方向移动，当掺量在一定范围内，即废弃电路板非金属粉末对

水泥水化反应的促进作用大于填充作用造成的不利影响时，试件强度得以提高。

（5）探讨了废弃电路板非金属粉末在建材中资源化利用的环境和经济效益

及应用前景。在监管部门批准的前提下，巨大的建材市场可以很好地消化废弃电

路板非金属粉末，并且能节省大量混凝土和砂浆的材料成本，当这种固体废弃物

掺量达 30%时企业可免税 17%，经济效益明显。

关键词：废弃电路板非金属粉末水泥基增强材料装饰砂浆固体废

弃物资源化利用

ABSTRACT

The recycling of the PCB nonmetal powder is still a difficult technical problem,

given the huge demand for building materials in our country, this article envisaged the

PCB nonmetal powder used in building materials, in the view of improving the

performance of building materials, at the same time, a lot of PCB nonmetal powder

can be processed. Two aspects Are considered in this paper : the first is to explore the

research of as reinforced cement, on the other hand is a kind of adornment formulated in the

mortar. In this paper, the main work is as follows:

(1) PCB nonmetal powder are analyzed in chemical elements and harmlessness.

PCB nonmetal powder as the main elements of carbon and oxygen, accounted for

79%, silicon content was 7.56%, and the calcium content is 3.64%, and silicon and

calcium can promote the cement hydration reaction, which is the theory basis of

reinforced cement idea. At the same time, the heavy metal content in the nonmetal

powder waste circuit board within the scope of the security, especially the harm such

as zinc, mercury, beryllium large heavy metal content is beyond the minimum value.

Environmental testing analysis and biological toxicity test, according to the results of

PCB nonmetal powder are safe and non-toxic, it is the premise to be used for building

materials.

(2)The experiment explores the PCB nonmetal powder as cement reinforced

material. Will be in the form of two different PCBS nonmetal powder mixed with

concrete and mortar specimens,when the fine powder PCB nonmetal powder content

in the concrete specimens was 16.5%, early strength increased by 22%, when the

specimens of fibrous PCB nonmetal powder content in the mortar specimens was

5.5%, the specimen early strength increased by 22%. When powder adding quantity

38.5%, the specimen is honeycomb shape, this is because the powder filling effect of

reduced the proportion of cement. Experiment proves that the nonmetal powder can

be used as cement reinforced material, waste circuit board under the limit of certain

dosage can improve the strength of concrete and mortar specimens.

(3)Test explored to PCB nonmetal powder as raw material to make a decorative

mortar. Using two types of nonmetal powder color forms, the characteristics of

compound decorative mortar, as well as by adding mineral fuel rich color decoration

mortar. In this article, through high pressure air injection apparatus to decoration

mortar spraying water on the walls, plaster sculpture and concrete slab and

ornamental effect is good and not easy to fall off. At the same time, in this paper,

decorative mortar strength and flexural strength, and tensile bonding strength test,

meet the demand of its mechanical properties as decoration mortar. Experiment

showed that the PCB nonmetal powder as a decorative mortar is feasible and effective,

and can deal with PCB nonmetal powder in large quantities.

(4) From the aspects of both chemistry and physics of PCB nonmetal powder

cement reinforced mechanism are analyzed, and explain the PCB on the impact of

nonmetal powder on strength of mortar and concrete specimens. Fine powder is

analyzed in this paper, at the same time by laser particle size analyzer of PCBS

nonmetal powder particle size distribution, particle size analysis showed that 95.6%

of fine powder of PCB nonmetal powder particle size is less than 132 microns, can

play a role of micro aggregate, filling water slurry clearance, enhance the strength of

specimens. nonmetal powder and fibrous PCB can the disorderly to reinforcement

effect, can also play a role in enhancing the effect of strength of specimens. PCB

nonmetal powder of silicon and calcium can promote the cement hydration reaction to

the moving direction, when the dosage of a certain range, the nonmetal powder of

cement hydration reaction of promoting effect is greater than the negative influence of

filling effect, strength of specimens.

(5) Explores the environmental and economic benefits and application prospects

of waste printed circuit boards in building materials, nonmetal powder in resource

utilization. Under the premise of regulatory approvals, our massive consumption of

cement products can be a good digestion PCB nonmetallic powder, and can save a lot

of material costs.

Key word: PCB nonmetal powder , cement reinforced material ,

decoration mortar , solid waste , reutilization

中文摘要

ABSTRACT

第一章绪论................................................................................................................1

1.1 电子废弃物处置问题现状..............................................................................1

1.1.1 电子废弃物产生现状............................................................................1

1.1.2 电子废弃物的组成................................................................................1

1.1.3 电子废弃物的危害................................................................................1

1.2 PCB 非金属粉末的组成及危害...................................................................... 3

1.3 PCB 非金属粉末的利用现状.......................................................................... 4

1.3.1 常规处置方法........................................................................................4

1.3.2 制备复合材料........................................................................................4

1.3.3 用于建材中的研究现状........................................................................5

1.3.4 PCB 非金属粉末资源化利用所存在的问题........................................ 6

1.4 本课题研究目的及方案..................................................................................7

1.4.1 研究目的................................................................................................7

1.4.2 问题的提出及研究方案........................................................................8

第二章 PCB 非金属粉末化学组成及无害性分析..................................................... 9

2.1 PCB 非金属粉末的化学组成分析.................................................................. 9

2.2 PCB 非金属粉末的无害性分析.................................................................... 10

2.2.1 PCB 非金属粉末环保监测分析.......................................................... 10

2.2.2 PCB 非金属粉末生物测试分析.......................................................... 13

2.3 本章小结........................................................................................................13

第三章 PCB 非金属粉末作为水泥基增强材料的研究............................................ 15

3.1 试验材料及仪器............................................................................................15

3.2 试验方案及试验过程....................................................................................16

3.2.1 试件制作方案......................................................................................16

3.2.2 试件制作过程......................................................................................17

3.2.3 抗压强度试验......................................................................................19

3.3 试件强度试验结果及分析............................................................................21

3.3.1 试件强度试验数据处理......................................................................21

3.3.2 试件强度试验结果..............................................................................21

3.3.3 试件强度试验结果分析......................................................................22

3.4 本章小结........................................................................................................25

第四章 PCB 非金属粉末作为装饰性材料的探究................................................... 27

4.1 试验材料及试验方案....................................................................................27

4.1.1 PCB 装饰砂浆配置原则...................................................................... 27

4.1.2 试验材料及方案设计..........................................................................27

4.1.3 PCB 装饰砂浆喷射工艺及配合比...................................................... 28

4.2 PCB 装饰砂浆抗压强度性能试验................................................................ 28

4.2.1 立方体试验试件的制备......................................................................28

4.2.2 PCB 装饰砂浆抗压强度测试结果...................................................... 29

4.2.3 PCB 装饰砂浆抗压强度性能分析...................................................... 29

4.3 PCB 装饰砂浆抗折强度性能测试................................................................ 30

4.3.1 PCB 装饰砂浆抗折强度测试结果...................................................... 30

4.3.2 PCB 装饰砂浆抗折强度性能分析...................................................... 31

4.4 PCB 装饰砂浆拉伸粘接强度性能测试........................................................ 32

4.4.1 PCB 装饰砂浆拉伸粘接强度测试方案.............................................. 32

4.4.2 PCB 装饰砂浆拉伸粘接强度测试结果.............................................. 33

4.4.3 PCB 装饰砂浆拉伸粘接强度性能分析.............................................. 34

4.5 PCB 装饰砂浆喷射工艺试验........................................................................ 35

4.5.1 PCB 装饰砂浆的颜色调制.................................................................. 35

4.5.2 PCB 装饰砂浆墙面喷射效果探讨...................................................... 36

4.5.3 PCB 装饰砂浆石膏雕塑喷射效果探讨.............................................. 38

4.6 本章小结........................................................................................................40

第五章 PCB 非金属粉末影响水泥基强度的机理分析........................................... 41

5.1 PCB 非金属粉末粒度分析............................................................................ 41

5.1.1 激光粒度分析仪原理..........................................................................41

5.1.2 激光粒度分析仪操作步骤..................................................................42

5.1.3 激光粒度分析测试结果......................................................................43

5.2 物理填充作用机理分析................................................................................44

5.2.1 微集料填充效应..................................................................................44

5.2.2 纤维增强效应......................................................................................45

5.2.3 聚合物增强效应..................................................................................46

5.2.4 PCB 非金属粉末对水泥基材料强度削弱的影响.............................. 47

5.3 化学反应机理分析........................................................................................47

5.3.1 水泥熟料水化反应..............................................................................47

5.3.2 PCB 非金属粉末对水泥水化反应影响.............................................. 48

5.4 本章小结........................................................................................................49

第六章环境与经济效益及应用前景分析................................................................50

6.1 PCB 非金属粉末用于建材的环境效益分析................................................ 50

6.2 PCB 非金属粉末用于建材的经济效益分析................................................ 51

6.2.1 作为水泥基增强材料时的经济效益分析..........................................51

6.2.2 作为装饰砂浆时的经济效益分析......................................................52

6.3 应用前景分析................................................................................................53

6.4 本章小结........................................................................................................54

第七章结论与展望....................................................................................................55

7.1 结论..............................................................................................................55

7.2 展望..............................................................................................................56

参考文献......................................................................................................................57

在读期间公开发表的论文和承担科研项目及取得成果..........................................61

致谢............................................................................................................................62

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摘要：

摘要废弃电路板非金属粉末的资源化处理是目前急需解决的技术难题。本文考虑到我国对建材的需求量巨大，因此提出将废弃电路板非金属粉末应用于建筑材料中，在保障建筑材料应用性能的同时，也实现了废弃电路板非金属粉末的资源化利用。课题从两个方面考虑资源化利用废弃电路板非金属粉末，一是探究将其作为水泥基增强材料，另一方面是将其配制为一种装饰砂浆，本文主要开展的研究工作如下：（1）对废弃电路板非金属粉末进行了化学元素组成分析并验证了它的无害性。废弃电路板非金属粉末中主要元素为碳和氧，共占79%，硅元素含量达7.56%，钙元素含量为3.64%，并且硅与钙可促进水泥水化反应，这也是将其作为水泥基增强材料的理论依据。...

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